| Wednesday, January 02, 2008
Engineering colleges sign MoU on industry-academic relationships
CHENNAI: R.M.K. and R.M.D. Engineering Colleges
signed memorandum of understanding with Wipro Technologies to
expand industry-academic relationships recently. The memorandum
would help the students, said Wipro officials.
The tie-up is expected to provide a platform for an effective
transfer of knowledge from the experts in Wipro, said R.S. Munirathinam,
founder chairman of the RMK Group of institutions.
Courtesy: The Hindu
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